Shenzhen · Full-Stack AIoT Original Manufacturer

From Silicon to System.

We engineer and manufacture custom edge-intelligence hardware for global OEMs — and supply the components that build it. One team, one technology stack, one closed loop from the core board to the 3D dashboard.

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10+
Chip Platforms
2000+
Compatible Devices
8L
Full-Stack Layers
50+
Component Brands
Compliance & Certification Support
CE FCC RoHS REACH UL ISO 9001 IEC GDPR-ready
Two Engines · One Partner

We build the product. And we supply the parts you build it with.

Most suppliers do one or the other. We do both — which means your BOM, your board and your finished system can all come from a single accountable partner, with one project manager and one consistent voice.

Engine A

Full-Stack Custom R&D and Manufacturing

Hardware, firmware, OS, cloud, edge AI, visualisation and security — engineered by one team and delivered as a working product, not a stack of components.

  • Core boards (SoM), PCBA, enclosure ID/MD, tooling, SMT and full-unit test
  • 10+ mainstream chip platforms — flexible selection, no single-vendor lock-in
  • Custom Linux (EdgeOS / AiotOS), container deployment and OTA firmware updates
  • IoT PaaS: rules engine, event engine, API gateway, 2D/3D digital twin
  • Zero-trust security: AES-256 / ECC, TLS 1.3, SN + Token + CA triple authentication
  • CE / FCC / RoHS / REACH certification support and export documentation
Explore the 8-layer capability stack
Engine B

Global Electronic Components Distribution

Active and passive components from the brands your design already specifies — sourced, verified, kitted and shipped, with BOM-level service instead of part-level price wars.

  • Active components: MCU/MPU, FPGA, analog, power, discrete, memory, RF, sensors, opto
  • Passive components: resistors, capacitors, inductors, crystals, connectors, relays, protection
  • 50+ international brands through franchised and authorised channels
  • Full BOM kitting, cross-reference and end-of-life / shortage resolution
  • Batch traceability, CoC and RoHS / REACH documentation
  • PCB / PCBA quick-turn services that plug straight into Engine A
Browse the component catalogue
Full-Stack Capability

Eight layers, one team, one closed loop

No handing your project between a hardware house, a firmware shop, a cloud vendor and a front-end studio. Eight layers of the stack are owned by the same engineers — so responsibility is singular and the specification never drifts between suppliers.

01 / HARDWARE

Hardware Design & Contract Manufacturing

SoM, PCBA, ID/MD, enclosure tooling, SMT and full-unit test. RS232/485, CAN, Ethernet, SFP, HDMI, USB, 5G/Wi-Fi 6, PoE.

02 / EMBEDDED

Embedded & Low-Level (C/C++/Rust)

Kernel-level drivers and memory-safe Rust system services. In-house NH-VFS and HyperStream capture/encode engine with millisecond latency.

03 / OS

Operating System

Custom Linux (EdgeOS / AiotOS) tuned for edge and IoT. ARM/x86 and domestic silicon support, containerised deployment, FOTA updates.

04 / CLOUD

Cloud–Edge Backend (Go/Rust)

IoT PaaS: rules engine, event engine, API gateway, metadata management, dashboard engine. PostgreSQL + PostGIS + TDengine + MongoDB + MinIO.

05 / EDGE AI

Edge AI · NPU Inference

2–40 TOPS NPU, INT4/INT8/INT16/FP16 precision. PyTorch / ONNX / TensorFlow / Caffe. Defect detection, behaviour recognition, anomaly audio.

06 / FRONTEND

Front-End & Visualisation

2D/3D digital twin, BIM/GIS fusion, high-frame-rate WebGL. Drag-and-drop SCADA authoring. Windows / macOS / iOS / Android / Linux / Web.

07 / SECURITY

Security & Encryption

AES-256 / RSA / ECC / SHA-256, TLS 1.3 / DTLS, TPM and USB-Key, tamper self-destruct. Zero trust via SN + Token + CA, micro-segmentation, GDPR-aligned.

08 / NETWORK

Protocols & Networking

Adaptive QUIC / UDP / TCP, in-house DM101 IoT protocol, P2P hole punching over 4G/5G/broadband. Replaces MPLS lines with end-to-end AES-256/ECC.

See the full capability specification
Solution Categories

Start from a solution that already exists

Every category below is a real, shipped project pattern — not a concept. Bring us your specification, enclosure, certification target and compliance requirement, and we customise from there.

Edge Control Terminal

Industrial KVM + edge AI + digital twin + multi-protocol, in one unit

Typical Applications
Production line control Server room monitoring Smart manufacturing
View details

Zero-Trust Networking

P2P + AES-256/ECC encryption + intelligent protocol stack gateway

Typical Applications
Cross-border networking Chain store backhaul SCADA uplink
View details

Streaming & AV

HyperStream capture and encoding with RTMP / RTSP / WebRTC delivery

Typical Applications
Video conferencing Live production IP-KVM Digital signage
View details

Outdoor Monitoring Station

All-weather AIoT, on-device NPU inference, dual time-series databases

Typical Applications
Water & utilities Environmental Meteorology Chemical warning
View details

IoT Platform (PaaS / SaaS)

Device onboarding, data governance, rules engine and visualisation

Typical Applications
Smart campus Smart city Industry platforms
View details

Fully Custom Categories

Bring your own specification — we engineer from a blank sheet

Customisable
Compute Interfaces Enclosure Certification
View details
Electronic Components

Active and passive components, one BOM at a time

Franchised and authorised supply across the brands already written into your schematic — with the engineering support to cross-reference, de-risk and consolidate your bill of materials.

A1–A9

Active Components

MCU / MPU / SoC, FPGA, analog & mixed-signal, power management, discrete, memory, RF & wireless, sensors, opto and drivers.

P1–P9

Passive Components

Resistors, capacitors, inductors & magnetics, crystals, connectors, relays & switches, protection and EMC filters.

50+

Global Brands

From TI, ADI, ST, Infineon and NXP to Murata, TDK, Yageo, TE and Molex — sourced through authorised channels.

P9

PCB / PCBA

Quick-turn prototyping, multilayer and HDI boards, SMT turnkey assembly and functional test — the bridge to Engine A.

Why source with us

Not a marketplace. A supply partner.

Price is the easy part. What costs you money is a shortage two weeks before production, an unverified grey-market reel, or a BOM with eleven different vendors and eleven different lead times.

  • Franchised and authorised channels — no unverified grey market
  • Full BOM kitting: one quote, one shipment, one point of accountability
  • Cross-reference and pin-compatible alternates when a part goes EOL
  • Batch traceability with CoC, RoHS and REACH documentation
  • Engineering review of your BOM before we quote it
  • PCB / PCBA service so parts become a working board
Open the Component Catalogue Upload a BOM
// Coverage Snapshot
Semiconductors9 categories
Passives8 categories
Brand lines50+ brands
BOM supportTurnkey
PCB / PCBA1–10 pcs quick turn
Showcase catalogue below. Our live inventory covers far more than the representative parts listed — send us your BOM and we will quote against real stock and verified lead times.
How We Work

From requirement to mass production

A transparent, five-stage process. You always know where your project stands and what comes next.

01

Requirement

You define the chip platform, specification, enclosure, certification and compliance target. NDA signed first.

02

BOM & Architecture

We return BOM analysis, system architecture and pricing — including component sourcing options.

03

Prototype

Working samples delivered for functional and interface validation, with firmware and cloud connectivity.

04

Design Validation

DVT, thermal, EMC pre-scan and reliability testing. Certification documentation prepared.

05

Mass Production

SMT, assembly, full-unit test, aging and shipment — with ongoing component supply continuity.

Tell us what you need to build.

Hardware, firmware, cloud, edge AI, components or all of it. Send us a requirement or a BOM and we will come back with a technical response and a real quotation.

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