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Full-Stack R&D and Manufacturing

Eight Layers. One Team. One Closed Loop.

We are a Shenzhen-based AIoT original manufacturer. Our position is that of a research and manufacturing base for our clients: you define the chip platform, specification, enclosure, certification and compliance; we engineer and manufacture the end-to-end solution from the core board to the cloud dashboard.

10+
Mainstream Chip Platforms
2000+
Compatible Device Models
8
Full-Stack Technology Layers
IEC
International Standards
The Stack

What each layer actually delivers

Most projects fail at the seams — where hardware meets firmware, where firmware meets cloud, where cloud meets the operator's screen. We own every seam.

Layer 01 · Hardware

Hardware Design & Contract Manufacturing

From core board to finished enclosure, including tooling and full-unit test.

  • Core boards (SoM), PCBA, complete-unit ID/MD design
  • Enclosure tooling, injection and mechanical validation
  • SMT placement, DIP assembly and complete-unit functional testing
  • Interfaces: RS232 / RS485, CAN, Ethernet, SFP, HDMI, USB, 5G / Wi-Fi 6, PoE
  • Support for 10+ mainstream chip platforms — NXP, NVIDIA, TI, ST, Qualcomm, Rockchip, Allwinner, HiSilicon, MediaTek and more
// Hardware Deliverables
SchematicDelivered
PCB LayoutDelivered
BOMSourced
Gerber / ODB++Delivered
Test JigOptional
Enclosure 3DDelivered
Layer 02 · Embedded

Embedded & Low-Level Engineering

Kernel-level drivers and memory-safe system services in C, C++ and Rust.

  • Kernel-level device drivers and BSP porting
  • Memory-safe Rust system services where stability is critical
  • In-house kernel-level virtual file system (NH-VFS)
  • HyperStream engine: GPU zero-copy capture and hardware encoding with millisecond-level latency
  • Low CPU overhead even with multiple concurrent high-resolution streams
// Capture Pipeline
GPU captureZero-copy
HW encodeNVENC / QSV / AMF
LatencyMillisecond class
ConcurrencyMulti-stream
Layer 03 · Operating System

Custom Linux for Edge and IoT

EdgeOS / AiotOS — our own optimised Linux distributions, built for unattended industrial deployment.

  • Multi-architecture support: ARM, x86, plus domestic silicon
  • Containerised application deployment and orchestration
  • FOTA firmware update with rollback safety
  • Device grouping, task scheduling and state monitoring
  • Long-term maintenance branches for multi-year product lifecycles
// OS Layer
EdgeOSEdge optimised
AiotOSIoT optimised
ContainersDocker-class
FOTAWith rollback
ArchitecturesARM / x86
Layer 04 · Cloud–Edge Backend

IoT Middle Platform (PaaS)

A fully containerised platform for device onboarding, data governance and industrial dashboards.

  • Rules engine, event engine, API gateway and metadata management
  • Dashboard engine for operations centres and control rooms
  • Polyglot persistence: PostgreSQL + PostGIS + TDengine + MongoDB + MinIO
  • Kafka-based high-concurrency pipelines handling tens of millions of documents
  • Private deployment available — your data never needs to leave your network
// Platform Services
Rules engineVisual authoring
Event engineStreaming
API gatewayOpenAPI
Databases5 engines
DeploymentOn-prem / cloud
Layer 05 · Edge AI

NPU Inference at the Edge

Real-time inference on the device — low latency, no cloud round-trip, and no sensitive data leaving the site.

  • 2–40 TOPS NPU with INT4 / INT8 / INT16 / FP16 precision options
  • Framework compatibility: PyTorch, ONNX, TensorFlow, Caffe
  • Model conversion, quantisation and on-device optimisation
  • Applications: defect detection, behaviour recognition, voiceprint and image recognition, equipment anomaly audio detection
  • Edge scripting engine for control logic — class-C and JavaScript ES5/ES6
// Edge AI Use Cases
Defect detectInline
BehaviourReal time
Audio anomalyPredictive
Compute range2–40 TOPS
PrivacyOn-device only
Layer 06 · Front-End & Visualisation

2D / 3D Digital Twin

The layer your operators actually judge the product by. Built with UniApp, Vue and Three.js.

  • 2D and 3D digital twin with BIM / GIS fusion
  • High-frame-rate WebGL rendering for large scenes
  • Drag-and-drop SCADA configuration — no developer required to change a screen
  • Cross-platform clients: Windows, macOS, iOS, Android, Linux and web
  • Live device state mapping for real-time optimisation and decision support
// Visualisation Stack
EngineThree.js / WebGL
Digital twin2.5D / 3D
BIM / GISFusion
Platforms6 targets
SCADA editorDrag & drop
Layer 07 · Security

Security & Encryption

Security designed in from the silicon up, not bolted on at the application layer.

  • Globally standard cryptography: AES-256, RSA, ECC, SHA-256, TLS 1.3 / DTLS
  • Hardware anchors: TPM chips, USB-Key physical tokens, tamper-detect self-destruct
  • Zero trust: SN + Token + CA triple authentication with micro-segmentation
  • Optional SM2 / SM3 / SM4 for regional compliance requirements
  • GDPR-aligned data handling and on-premise deployment option
// Security Layers
TransportTLS 1.3 / DTLS
CipherAES-256 / ECC
Hardware rootTPM / USB-Key
IdentitySN + Token + CA
ComplianceGDPR-ready
Layer 08 · Protocols & Networking

Communication and Networking

Replace expensive leased lines and fragile VPNs with an encrypted peer-to-peer fabric.

  • Adaptive QUIC / UDP / TCP transport selection
  • DM101, our in-house IoT protocol
  • P2P hole punching across 4G, 5G and broadband — no third-party relay
  • End-to-end AES-256 / ECC encryption with IPv4 / IPv6 dual stack
  • Significantly lower bandwidth cost than MPLS, with faster connection establishment on weak networks
// Network Fabric
TransportQUIC / UDP / TCP
TopologyP2P direct
ProtocolDM101
EncryptionAES-256 / ECC
AddressingDual stack
Chip Platform Matrix

Hardware bases are not tied to a single silicon vendor

Select freely on cost, compute, supply continuity and compliance. Already in volume production or fully ported: 10+ mainstream platforms, including domestic-silicon options for supply-chain resilience.

BrandRepresentative PlatformPositioning & Typical Applications
NXPi.MX 6 / 8 series (i.MX 8M Plus)Industrial long-lifecycle and automotive grade; industrial control, in-vehicle, medical
NVIDIAJetson Nano / Orin / AGXHigh-compute edge AI inference (20–275 TOPS); machine vision, robotics, autonomous driving
Texas InstrumentsSitara AM series / OMAPIndustrial real-time control, power and energy, motor drive
STMicroelectronicsSTM32MP1 / MP2Low-power industrial gateways, metering, sensor nodes
QualcommSnapdragon / QCS seriesHigh-performance mobile-class and video / communication-intensive terminals
RockchipRK3568 / RK3588 / RK3399High price-performance ARM; gateways, tablets, edge AI boxes
AllwinnerA series / T seriesConsumer and in-vehicle displays, cost-optimised terminals
HiSiliconHi3516 / Hi3559Video surveillance, security, intelligent vision
MediaTekMT7621 / MT8 seriesNetwork communications, routers, industrial gateways
Horizon RoboticsJourney series (J3 / J5)Automotive-grade AI silicon; autonomous driving, ADAS
Domestic siliconKunpeng / Phytium / ZhaoxinRegionally compliant and self-controlled projects

The above are representative platforms on which we already hold design and volume-manufacturing capability, not an exhaustive list. If you nominate a specific chip solution, we can take on the core board, PCBA and complete-unit custom development and contract manufacturing.

Why Clients Choose This Structure

What full-stack ownership means for you

The value is not that we can do eight things. It is that you no longer have to coordinate eight suppliers.

Singular Accountability

One project manager owns the entire chain. One voice, one schedule, no finger-pointing between vendors.

Source Code, Auditable

Source licensing available, private deployment supported, and your data does not have to leave your own network.

Days, Not Quarters

A requirement change propagates through every layer in days because all layers are staffed by one team.

Industrial-Grade Reliability

Wide temperature and wide voltage operation, strong EMC performance, designed for long-term unattended service.

Supply Continuity

Chip-agnostic design plus in-house component sourcing means a shortage is an engineering problem we can solve.

Everything Is Delivered

Schematic, PCB, BOM, SDK, cloud platform, dashboard — you receive a complete, maintainable product.

Send us your specification.

Tell us the chip platform, the interfaces, the enclosure and the certification target. We will respond with an architecture proposal, a BOM view and an indicative quotation.